Thermal Management for ARM-based Systems

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One Line Summary

How should thermal management for ARM devices be done within existing thermal constructs (hwmon and thermal framework)


Thermal management is now a key consideration in ARM-based products. Due to the inherent low power nature of ARM-based solutions, power consumption has been a key care-about, but as ARM-based systems move up the performance curve, managing thermal is also now a key consideration. Most ARM-based products are in portable form factors, and traditional means of silicon thermal management (heat sinks, fans, etc.) are not available. Silicon thermal management needs to be done on-die, and integrating the on-die hardware into the Linux stack is explored. Proposals for both a user-space thermal policy manager is considered, along with requirements and challenges in adopting the existing kernel thermal framework.


ARM, thermal, power management


  • Steve Jahnke

    Texas Instruments, Linaro


    Steve Jahnke is a Product Architect for Linux Systems for the Texas Instruments Incorporated (TI)
    wireless business unit. In this role, Jahnke ensures that the OMAP silicon features are fully entitled in all Linux-based devices, in all
    stages of development – from architecture and design, to testing and final release. During his 15 years at TI, Jahnke has held several roles
    focused on System-on-Chip (SoC) and software design for the automotive, communication and consumer electronic markets. He earned a master’s
    degree in electrical engineering from Rice University (Houston, Tx) and a bachelor’s
    degree in electrical engineering from Northwestern University (Evanston, IL).